Questions tagged [die]
A die is a small block of semiconducting material on which a given functional integrated circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
33 questions
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Die Size and IC Package
I would like to gain a better understanding of IC package lead inductance and on-die capacitance. For a physically larger IC chip, would the on-die capacitance generally be higher due to the reduced ...
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Are these old graphic controllers all the same die packaged by different manufacturers? [closed]
I am looking at old ISA graphic adapters that would provide a simple black and white text mode. I am trying to make the design as simple as possible and I would like to make the PCB as small as ...
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27 votes
4 answers
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Why do fabs bother to print circuitry right up to the edges of a wafer when they know that the partial dies will be discarded later?
Around the edge of a wafer (see image below) you will observe that there are many partial dies. It seems wasteful to use the lithography machine to print these partial dies because they will be ...
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1 vote
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How does MOSIS let designers “share” a mask set?
In Weste and Harris's CMOS VLSI Design, they describe MOSIS as follows: The MOSIS service [Piña02] is a low-cost prototyping service that collects designs from academic, commercial, and government ...
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9 votes
3 answers
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What shapes can IC dies be?
I know an IC die can be cut into a rectangular shape. Apparently triangles and rhombuses are also possible, but not used. What other tesselations can they be cut into?
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Inside a 2N3904 transistor TO-92 package
I cracked open this 2N3904 transistor. I lack the means to test its function until tomorrow. The die doesn't look like anything I've ever seen before. I'm not quite sure where the silicon is. In your ...
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5 votes
2 answers
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What could've killed my ESP32S MCU?
I'm making my project and I managed to kill 2 ESP32 boards. First time I thought it was just accident (me shorting 2 wires) because my cables were messy, but it happened again and the circumstances ...
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0 votes
2 answers
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Does the electrical parameters of a packaged transistor change from bare die transistors?
When comparing the electrical parameters of the MOSFET/Transistors, do they change when the package type changes? Are the parasitic parameters of the packaged MOSFET and bare die MOSFET change. It is ...
10 votes
5 answers
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ADC stops functioning when cold
EDIT: VERY INTERESTING TEST RESULTS I just tried inducing the thermal failure using an inverted "can of air" (likely difluoroethane). It even when its super cold, (might even be below -40C), ...
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1 answer
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CPU die: does it have in-die wires on single side of both?
Internet search finds single vs double sided memory, here discussions are about Printed Circuit Boards (PCBs) for singe vs double sided. I'm interested to know if e.g. Intel processors, as they are ...
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3 votes
1 answer
249 views
Silicon die on Peltier device with COB wirebonding
I have a camera sensor (bare die) that must go on a very tiny PCB that also contains electronics for data serialization that dissipate enough power to make the PCB pretty hot (40-60 deg. C). I want to ...
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1 answer
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Modelling ESR of a parallel plate capacitor
I am trying to model a parallel plate capacitor (on die capacitor generated using metal plates.) I know the capacitance per unit area, and metal sheet resistance. No knowledge of the dielectric. I ...
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Is there a common ballpark estimate for the percentage of an IC package that is taken up by the die?
Not a very technical question but I'm interested in finding out the average size of a 3-axis accelerometer die. I’m finding that the smaller package sizes are around 2x2x1mm, is there a way of ...
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2 answers
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Help identifying a decapped IC chip [closed]
I have a 24 pin IC chip that was soldered onto a tiny PCB. I was able to decap the chip and read the label, but I am not finding any information through Google. Does anyone recognize this label that ...
user271623
2 votes
1 answer
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When should bare die be used instead of QFN/BGA packages?
I have no experience with bare die as a package, and I have been recently tasked with deciding between bare die, BGA, or QFN package for a SoC. Searching the internet, I have not really found much ...
